JPH0420264U - - Google Patents
Info
- Publication number
- JPH0420264U JPH0420264U JP6246390U JP6246390U JPH0420264U JP H0420264 U JPH0420264 U JP H0420264U JP 6246390 U JP6246390 U JP 6246390U JP 6246390 U JP6246390 U JP 6246390U JP H0420264 U JPH0420264 U JP H0420264U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- soldering
- foil circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6246390U JPH0420264U (en]) | 1990-06-13 | 1990-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6246390U JPH0420264U (en]) | 1990-06-13 | 1990-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420264U true JPH0420264U (en]) | 1992-02-20 |
Family
ID=31591634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6246390U Pending JPH0420264U (en]) | 1990-06-13 | 1990-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420264U (en]) |
-
1990
- 1990-06-13 JP JP6246390U patent/JPH0420264U/ja active Pending
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